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Communication Base Station Back Board


Multiple Surface Treatment Technology Printed Board


Communication Base Station Back Board


Multiple Surface Treatment Technology Printed Board


Multiple Surface Treatment Technology Printed Board


Multiple Surface Treatment Technology Printed Board


Conductive/Insulating Printed Board


Conductive/Insulating Printed Board


Buried Pad Printed Board


Peel-off Ink Printed Board


Peel-off Ink Printed Board


Special Material Printed Board


Aluminum Material


Special Material Printed Board


Buried Pad Printed Board

PCB Capabilities

Items Capability Items Capability
Template Batch Material FR4 / Hi-Tg / Rogers / Halogen Free / RCC PTFE / Nelco / Mixed lamination Materials
Number of Layers 2-64 L 2-58 L
Board Thickness 0.5-17.5mm 0.6-10mm Surface Treatment HASL、HASL PB FREE Immersion Gold/Tin/Silver Gold Finger Plating OSP、Immersion Gold + OSP
Drill Sizes - Min 0.1mm 0.2mm
Annular Ring - Min 3mil 4mil
HDI Type 1+n+1 \ 2+n+2 3+n+3 1+n+1 \ 2+n+2 Other Techniques Blind and Buried Vias / Step groove / metal substrate / embedded resistor / embedded capacitor / mixed pressure / soft and hard combination / back drill / step gold finger
Spacing/Tracing - Min 3/3mil 4/4mil
Maximum Layer Copper Thickness 12oz 6oz
Maximum Plate Thickness Aperture Ratio 18:1 16:1 PCBA Capacity 31.5 million Solder Joints/day
Maximum PCB Size 650mm X 1130mm 610mm X 1100mm PCBA Production line 30Article
Impedance Control +/-5% +/-10%

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